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切割(ge)用途(tu) |
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Cutting purpose |
主要用於(yu)手機鋼化膜(mo)、手機蓋(gai)板、TFT、觸(chu)摸(mo)屏、行(xing)車(che)記(ji)錄(lu)儀(yi)、光(guang)學(xue)玻璃(li)、電(dian)子玻(bo)璃(li)等(deng)玻璃(li)產品(pin)直(zhi)線(xian)和(he)曲線(xian)切(qie)割。
mainly used in the steel film, mobile phone cover, TFT, touch screen, driving recorder, optical glass, electronic glass and other glass products straight line and curve cutting.
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機器(qi)特(te)點 |
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The machine features |
l大理石工作(zuo)臺(tai)面(mian),不變形(xing),臺面(mian)平整度(du)高(gao),臺面(mian)平整度(du)小(xiao)於20um
lMarble work table, not deformed, the mesa flatness is high, mesa flatness is less than 20um
l大理石橫梁(liang),進口伺(si)服控(kong)制(zhi),定位(wei)精(jing)度(du)高(gao)
l Marble beams, imported servo control, high positioning accuracy
l 自動邊(bian)料(liao)切割,不浪費(fei)料(liao)
lAutomatic edge cutting, not waste material
l可任(ren)設(she)原點(dian)位(wei),原點(dian)補(bu)正(zheng)功(gong)能,切(qie)割中暫停功(gong)能
lCan be set at the origin, the origin complement function, the cutting function
l真(zhen)空(kong)吸(xi)附玻璃,自動(dong)吸(xi)氣/吹氣(qi)功(gong)能
lVacuum adsorption glass, automatically aspirating/blowing energy
l可選(xuan)擇(ze)CCD對(dui)位(wei)影(ying)像(xiang)裝置(zhi),高(gao)精度(du)切(qie)割
lCan choose CCD image device, high - precision cutting